Affiliation of Participant(s):4a4321c94a2af4ad014a2af5f603009c
Leading Scientist:宋佳男
Nature of Project:用于高频芯片散热的高性能高导热硅胶材料的研发
Date of Project Approval:2022-03-02
Scheduled completion time:2025-03-01
Date of Project Initiation:2022-03-02
Pre One:高导热硅橡胶的开发
Next One:硅橡胶复合材料的仿生结构调控及三维传热增强机制研究
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