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用于物联网的新型硅纳米材料高灵敏压力传感器第三代芯片加工
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Affiliation of Participant(s):500190
Leading Scientist:王权
Nature of Project:用于物联网的新型硅纳米材料高灵敏压力传感器第三代芯片加工
Date of Project Approval:2015-01-04
Scheduled completion time:2015-03-30
Date of Project Initiation:2015-01-04
Current position: