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Enhancing Adhesion and Reducing Ohmic Contact through Nickel-Silicon Alloy Seed Layer in Electroplating Ni/Cu/Ag

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Affiliation of Author(s):500190

Journal:MATERIALS

ISSN No.:1996-1944

Translation or Not:no

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刘海霞

Gender:Female Education Level:With Certificate of Graduation for Doctorate Study Alma Mater:江苏大学 Degree:doctor Status:在本单位任职 School/Department:材料科学与工程学院

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Enhancing Adhesion and Reducing Ohmic Contact through Nickel-Silicon Alloy Seed Layer in Electroplating Ni/Cu/Ag