Pre One:Zhou CJ, Yu Y, Zhang XZ, Cheng YD, Xu JT, Lee YK, Yoo B, Cojocaru-Miredin O, Liu GW, Cho SP, Wuttig M, Hyeon T, Chung I*. Cu Intercalation and Br Doping to Thermoelectric SnSe2 Lead to Ultrahigh Electron Mobility and Temperature-Independent Power Factor, Advanced Functional Materials, 2019, 30(6): 1908405
Next One:Yi M, Zhang XZ, Wang B, Liu GW*, Shao HC, Qiao GJ*, Comparative investigation on microstructures and mechanical properties of (TiB+TiC)/Ti-6Al-4V composites from Ti-B4C-C and Ti-TiB2-TiC systems, Materials Characterization,2018, 140: 281–289.