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Pre One:Liu GW*, Zhang XZ, Yang J, Qiao GJ. Recent advances in joining of SiC-based materials (monolithic SiC and SiCf/SiC composites): Joining techniques, joint strength and interfacial behavior, Journal of Advanced Ceramics, 2019, 8(1): 19–38
Next One:Zhou CJ, Yu Y, Zhang XZ, Cheng YD, Xu JT, Lee YK, Yoo B, Cojocaru-Miredin O, Liu GW, Cho SP, Wuttig M, Hyeon T, Chung I*. Cu Intercalation and Br Doping to Thermoelectric SnSe2 Lead to Ultrahigh Electron Mobility and Temperature-Independent Power Factor, Advanced Functional Materials, 2019, 30(6): 1908405
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