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Affiliation of Participant(s):500200
Leading Scientist:吉海燕
Nature of Project:高性能印刷电路板用无卤低损耗覆铜板的开发
Date of Project Approval:2022-03-21
Scheduled completion time:2025-06-30
Date of Project Initiation:2022-03-22
Pre One:防撞抗震耐磨型EPP汽车与交通工程学院（汽车工程研究院）耗材基础工艺及系列部件产品研发技术服务
Next One:新型EPP发泡工艺优化及系列产品开发
