First-principles study on elastic properties of Cu, (Cu1−x,Nix)3Sn and interfacial mechanical properties of (Cu1−x,Nix)3Sn/Cu in the lead-free solder joint
- Journal:Beilstein Journal of Nanotechnology
- Indexed by:SCI
- Document Type:SCI
- Volume:17
- Page Number:428-439
- Translation or Not:no
- Included Journals:SCI
- Publication links:https://www.beilstein-journals.org/bjnano/articles/17/29

