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Hou Jie, Li Baizhou, Xing Zeyu. Network Embeddedness, Integration and Modularity Capabilities, and Innovation Performance: A Complex Product Systems Perspective. IEEE Transactions on Engineering Management, 2026, 73: 3823-3835. (SSCI, FMS B级, ABS 3星)

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Next One:Zeng Xiaochun, Huang Mengsi, Hou Jie, Xing Zeyu. Towards smart and resilient manufacturing systems: A catastrophe entropy framework for longitudinal digital resilience monitoring. Computers & Industrial Engineering, 2026, 222, 112407. (SSCI, FMS B级, ABS 2星)