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大功率半导体用高性能铝碳化硅基板研发及产业化

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Affiliation of Participant(s):40400
Leading Scientist:程晓农
Nature of Project:大功率半导体用高性能铝碳化硅基板研发及产业化

Pre One:核反应堆乏燃料贮运用中子吸收板研发及产业化

Next One:高端热作模具钢的喷射成型关键技术及材料优化设计（合作）

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